Semikron Danfoss logo

24922300VM05

SK75GD12T7ETE2-M05

SEMITOP E2, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)63x57x12
Chip TechnologieIGBT T7
EigenschaftenOptimized design for superior thermal performanceLow inductive designPress-Fit contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
GehäuseSEMITOP E2
HerkunftslandItaly
ProduktlinieSEMITOP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)75 A
TechnologieIGBT
TopologieSixpack
TypeSEMITOP E2
Typische AnwendungsgebieteMotor drivesServo drivesAir conditioningAuxiliary InvertersUPS
Variant DescriptionThe SK75GD12T7ETE2-M05 is a 1200 V IGBT module and comes with a pre-applied 2.8mm height slim pressure lid and High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
VarianteHPTP

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.058 Kilogramm
Nettogewicht0.038 Kilogramm
Vorschlag 65Cancer and Reproductive Harm