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24920811VM05

SK35GD12T4ETp-M05

SEMITOP 3 Press-Fit, HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandItaly
Stromstärke (A)35 A
Spannung1200 V
TopologieSixpack
ProduktlinieSEMITOP
GehäuseSEMITOP 3 Press-Fit
Abmessungen (LxBxH)31x55x12
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenOne screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesTrench4 IGBT technologyCAL4F technology FWDIntegrated NTC temperature sensorUL recognized, file no. E 63 532
Typische AnwendungsgebieteMotor DrivesServo DrivesAir ConditioningAuxiliary InvertersUPS

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.035 Kilogramm
Nettogewicht0.026 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHPTP
Varianten BeschreibungThe SK35GD12T4ETp-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk35gd12t4etp-m05-24920811vm05">SK35GD12T4ETp-M05</a><a href="/products/p/sk35gd12t4etp-24920811">SK35GD12T4ETp</a>