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24922220VM05

SK35DGDL12T4ETE2V1-M05

SEMITOP E2, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)63x57x12
Chip TechnologieIGBT 4 (Trench)
EigenschaftenOptimized design for superior thermal performancesLow inductive designPress-Fit contact technology1200V Trench IGBT4 (T4)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
GehäuseSEMITOP E2
HerkunftslandItaly
ProduktlinieSEMITOP
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)35 A
TechnologieIGBT
TopologieCIB
TypeSEMITOP E2
Typische AnwendungsgebieteMotor drivesAir conditioningAuxiliary Inverters
Variant DescriptionThe SK35DGDL12T4ETE2V1-M05 is a 1200 V IGBT module and comes with a pre-applied 2.8mm height slim pressure lid and High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
VarianteHPTP

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.055 Kilogramm
Nettogewicht0.035 Kilogramm
Vorschlag 65Cancer and Reproductive Harm