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24919891VM05

SK35DGD12T4Tp-M05

SEMITOP 4 Press-Fit, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)61x55x12
Chip TechnologieIGBT 4 (Trench)
EigenschaftenOne screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesImproved thermal performances by aluminium oxide substrateTrench4 IGBT technologyCAL4F technology FWDIntegrated NTC temperature sensorUL recognized, file no. E 63 532
GehäuseSEMITOP 4 Press-Fit
HerkunftslandItaly
ProduktlinieSEMITOP
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)35 A
TechnologieIGBT
TopologieCI
Typische AnwendungsgebieteMotor drives
VarianteHPTP
Varianten BeschreibungThe SK35DGD12T4Tp-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.074 Kilogramm
Nettogewicht0.06 Kilogramm
Proposition 65Cancer and Reproductive Harm