24922550VM07
SK25DGDL12T7ETE2s-M07
SEMITOP E2 Solder, HP-PCM
24922550VM07
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 63x57x12 |
| Chip Technologie | IGBT T7 |
| Eigenschaften | Optimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532 |
| Gehäuse | SEMITOP E2 Solder |
| Herkunftsland | Italy |
| Produktlinie | SEMITOP |
| Produktstatus | In Production New |
| Spannung | 1200 V |
| Stromstärke (A) | 25 A |
| Technologie | IGBT |
| Topologie | CIB |
| Type | SEMITOP E2 Solder |
| Typische Anwendungsgebiete | Motor drivesAir conditioningAuxiliary Inverters |
| Variant Description | The SK25DGDL12T7ETE2s-M07 is a 1200 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a phase change material and offers superior thermal performance, which maximizes the module's power output or significantly increases its lifetime. The material is solid at room temperature and starts to flow only after very first operation, spread out and fill the gaps between module and cooler. |
| Variant Short Description | Module + High Performance Phase Change Material (HP-PCM) |
| Variante | HP-PCM |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.055 Kilogramm |
| Nettogewicht | 0.035 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |