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24923250VM07

SK15DGD12T7ETE1s-M07

SEMITOP E1 Solder, HP-PCM

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandItaly
Stromstärke (A)15 A
Spannung1200 V
TopologieCI
ProduktlinieSEMITOP
GehäuseSEMITOP E1 Solder
Abmessungen (LxBxH)63x34x12
TechnologieIGBT
Chip TechnologieIGBT T7
EigenschaftenOptimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typische AnwendungsgebieteMotor drivesAir conditioningAuxiliary Inverters

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.022 Kilogramm
Nettogewicht0.022 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHP-PCM
Varianten BeschreibungThe SK15DGD12T7ETE1s-M07 is a 1200 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a silicone-free phase change material (PCM) having a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface.
Varianten KurzbeschreibungModule + High Performance Phase Change Material (HP-PCM)
Variants<a href="/products/p/sk15dgd12t7ete1s-m05-24923250vm05">SK15DGD12T7ETE1s-M05</a><a href="/products/p/sk15dgd12t7ete1s-m07-24923250vm07">SK15DGD12T7ETE1s-M07</a><a href="/products/p/sk15dgd12t7ete1s-24923250">SK15DGD12T7ETE1s</a>