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Semikron Danfoss Standard Photo SEMITOP E1 Solder

24923050VM07

SK10DGDL12T7ETE1s-M07

SEMITOP E1 Solder, HP-PCM

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)63x34x12
Chip TechnologieIGBT T7
EigenschaftenOptimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
GehäuseSEMITOP E1 Solder
HerkunftslandItaly
ProduktlinieSEMITOP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)10 A
TechnologieIGBT
TopologieCIB
Typische AnwendungsgebieteMotor drivesAir conditioningAuxiliary Inverters
VarianteHP-PCM
Varianten BeschreibungThe SK10DGDL12T7ETE1s-M07 is a 1200 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a phase change material and offers superior thermal performance, which maximizes the module's power output or significantly increases its lifetime. The material is solid at room temperature and starts to flow only after very first operation, spread out and fill the gaps between module and cooler.
Varianten KurzbeschreibungModule + High Performance Phase Change Material (HP-PCM)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.022 Kilogramm
Nettogewicht0.022 Kilogramm
Proposition 65Cancer and Reproductive Harm