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24923210VM07

SK10DGD12T7ETE1s-M07

SEMITOP E1 Solder, HP-PCM

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)63x34x12
Chip TechnologieIGBT T7
GehäuseSEMITOP E1 Solder
HerkunftslandItaly
ProduktlinieSEMITOP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)10 A
TechnologieIGBT
TopologieCI
TypeSEMITOP E1 Solder
Typische AnwendungsgebieteMotor drivesAir conditioningAuxiliary Inverters
Variant DescriptionThe SK10DGD12T7ETE1s-M07 is a 1200 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a silicone-free phase change material (PCM) having a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface.
Variant Short DescriptionModule + High Performance Phase Change Material (HP-PCM)
VarianteHP-PCM

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.022 Kilogramm
Nettogewicht0.022 Kilogramm
Proposition 65Cancer and Reproductive Harm