Semikron Danfoss logo

24923200VM05

SK10DGD12T7ETE1-M05

SEMITOP E1, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)63x34x12
Chip TechnologieIGBT T7
EigenschaftenOptimized design for superior thermal performanceLow inductive designPress-Fit contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
GehäuseSEMITOP E1
HerkunftslandItaly
ProduktlinieSEMITOP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)10 A
TechnologieIGBT
TopologieCI
TypeSEMITOP E1
Typische AnwendungsgebieteMotor drivesAir conditioningAuxiliary Inverters
Variant DescriptionThe SK10DGD12T7ETE1-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
VarianteHPTP

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.022 Kilogramm
Nettogewicht0.022 Kilogramm
Proposition 65Cancer and Reproductive Harm