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24921600VM05

SK100MLI07S5TD1E2-M05

SEMITOP E2, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)63x57x12
Chip TechnologieTrench 5 (S5)
EigenschaftenOptimized design for superior thermal performanceLow inductive designPress-Fit contact technologySplit IGBT gates for optimized driving650V Trench5 IGBT (S5)Rapid switching diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
GehäuseSEMITOP E2
HerkunftslandItaly
ProduktlinieSEMITOP
ProduktstatusIn Production
Spannung650 V
Stromstärke (A)100 A
TechnologieIGBT
Topologie3-Level
Typische AnwendungsgebieteUPSEnergy Storage SystemsSolar
VarianteHPTP
Varianten BeschreibungThe SK100MLI07S5TD1E2-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.055 Kilogramm
Nettogewicht0.035 Kilogramm
Proposition 65Cancer and Reproductive Harm