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24920390VM05

SK 75 GHL 07F3TD1-M05

SEMITOP 3, HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandItaly
Stromstärke (A)75 A
Spannung650 V
TopologieH-Bridge
ProduktlinieSEMITOP
GehäuseSEMITOP 3
Abmessungen (LxBxH)55x31x12
TechnologieIGBT
Chip TechnologieIGBT 3 (Trench)
EigenschaftenCompact designOne screw mounting moduleOptimum heat transfer and insulation through direct copper bonding aluminum oxide ceramic (DBC)650V Trench3 Fast IGBT technology650V Rapid switching diodeIntegrated NTC temperature sensorUL recognized, file no. E 63 532
Typische AnwendungsgebieteInverterWeldingUPS

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.039 Kilogramm
Nettogewicht0.03 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHPTP
Varianten BeschreibungThe SK 75 GHL 07F3TD1-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk-75-ghl-07f3td1-m01-24920390vm01">SK 75 GHL 07F3TD1-M01</a><a href="/products/p/sk-75-ghl-07f3td1-m05-24920390vm05">SK 75 GHL 07F3TD1-M05</a><a href="/products/p/sk-75-ghl-07f3td1-24920390">SK 75 GHL 07F3TD1</a>