27895300VM07
SEMiX603GB12E4SiCp-M07
SEMiX 3p, HP-PCM
27895300VM07
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 150x62x17 |
| Chip Technologie | SiC Diode + IGBT 4 (Trench) |
| Eigenschaften | With Silicon Carbide (SiC) Schottky diodesHomogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientPress-fit pins as auxiliary contactsThermally optimized ceramicUL recognized, file no. E63532 |
| Gehäuse | SEMiX 3p |
| Herkunftsland | Slovakia |
| Produktlinie | SEMiX |
| Produktstatus | In Production |
| Spannung | 1200 V |
| Stromstärke (A) | 600 A |
| Technologie | Hybrid SiC |
| Topologie | Half-Bridge |
| Type | SEMiX 3p |
| Typische Anwendungsgebiete | AC inverter drivesUPSRenewable energy systems |
| Variante | HP-PCM |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.381 Kilogramm |
| Nettogewicht | 0.35 Kilogramm |
| Vorschlag 65 | Cancer and Reproductive Harm |