27922900VM05
SEMiX305MLI12E4V2-M05
SEMiX 5p, HPTP
27922900VM05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 130x70x17 |
| Chip Technologie | IGBT 4 (Trench) |
| Eigenschaften | Solderless assembling solution with PressFIT signal pins and screw power terminalsIGBT 4 Trench Gate TechnologyV<sub>CE(sat) </sub>with positive temperature coefficientLow inductance caseReliable mechanical design with injection moulded terminals and reliable internal connectionsUL recognized file no. E63532NTC temperature sensor inside |
| Gehäuse | SEMiX 5p |
| Herkunftsland | Italy |
| Produktlinie | SEMiX |
| Produktstatus | In Production New |
| Spannung | 1200 V |
| Stromstärke (A) | 300 A |
| Technologie | IGBT |
| Topologie | 3-Level |
| Typische Anwendungsgebiete | Solar, Power Supply |
| Variante | HPTP |
| Varianten Beschreibung | The SEMiX305MLI12E4V2-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.475 Kilogramm |
| Nettogewicht | 0.39 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |