27892075VM05
SEMiX303GB17E4s-M05
SEMiX 3s, HPTP
27892075VM05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Produktstatus | In Production |
| Herkunftsland | Slovakia |
| Stromstärke (A) | 300 A |
| Spannung | 1700 V |
| Topologie | Half-Bridge |
| Produktlinie | SEMiX |
| Gehäuse | SEMiX 3s |
| Abmessungen (LxBxH) | 150x64x17 |
| Technologie | IGBT |
| Chip Technologie | IGBT 4 (Trench) |
| Eigenschaften | Homogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityUL recognized, file no. E63532 |
| Typische Anwendungsgebiete | AC inverter drivesUPSElectronic Welding |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.349 Kilogramm |
| Nettogewicht | 0.289 Kilogramm |
Variant information
Eigenschaften | Wert |
|---|---|
| Variante | HPTP |
| Varianten Beschreibung | The SEMiX303GB17E4s-M05 is a 1700 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
| Variants | <a href="/de-de/products/p/semix303gb17e4s-m04-27892075vm04">SEMiX303GB17E4s-M04</a><a href="/de-de/products/p/semix303gb17e4s-m05-27892075vm05">SEMiX303GB17E4s-M05</a><a href="/de-de/products/p/semix303gb17e4s-m06-27892075vm06">SEMiX303GB17E4s-M06</a><a href="/de-de/products/p/semix303gb17e4s-m07-27892075vm07">SEMiX303GB17E4s-M07</a><a href="/de-de/products/p/semix303gb17e4s-27892075">SEMiX303GB17E4s</a> |