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27890100VM05

SEMiX151GB12E4s-M05

SEMiX 1s, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)84x64x17
Chip TechnologieIGBT 4 (Trench)
EigenschaftenHomogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityUL recognized, file no. E63532
GehäuseSEMiX 1s
HerkunftslandSlovakia
ProduktlinieSEMiX
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)150 A
TechnologieIGBT
TopologieHalf-Bridge
Typische AnwendungsgebieteMotor DrivesPower SupplyMatrix Converter
VarianteHPTP
Varianten BeschreibungThe SEMiX151GB12E4s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.166 Kilogramm
Nettogewicht0.15 Kilogramm