Pushing Standards to New Limits
While semiconductor chips and the affixed DBC substrate appear inflexible, there is an element of elasticity that affects the contact to the heatsink. Because of this, increased mounting pressure can reduce thermal resistance. However, traditional designs with bond wires mean that this mounting pressure can only be applied around the chip or at the edge of the module. The flex-layer implemented with Double Sided Sintering Technology provides a durable, flat surface. Direct Pressed Die Technology takes full advantage of this by utilizing a compliant pressure element to provide mounting pressure directly to the top of the chip.
With Direct Pressed Die Technology, the DBC substrate is not directly affixed to the heatsink or mounting plate and only requires a very thin layer of thermal interface material. This makes the technology ideal for implementing with custom pin-fin heatsink inserts. Since Direct Pressed Die Technology incorporates Double Sided Sintering Technology, it also includes all the benefits such as extremely low commutation inductance.