Product specifications
Characteristic | Value |
|---|---|
| Case | MiniSKiiP II 0 |
| Chip Technology | Wacker P12 |
| Features | • Honeycomb structure• Optimized thickness of thermal paste layer• Enhanced heat dissipation• High process reliability due to automated screen printing process |
| Housing | MiniSKiiP II 0 |
| Part Number | 12281800 |
| Product Line | Thermal Interface Material |
| Product Type | TP(P12)Mini0 |
| Thickness (after assembly) in µm | 33 µm |
| Tolerances (+/-) in µm | 10 µm |