Product specifications
Characteristic | Value |
|---|---|
| Case | SEMITOP E2 |
| Chip Technology | High Performance Thermal Paste |
| Features | • New high performance thermal paste• Superior heat dissipation• Inhomogeneous honeycomb structure• Optimized thickness of thermal paste layer• High process reliability due to automated screen printing process |
| Housing | SEMITOP E2 |
| Part Number | 12281175 |
| Product Line | Thermal Interface Material |
| Product Type | TP(HPTP)SEMITOP_E2 |
| Weight in mg | 320 mg |