Product specifications
Characteristic | Value |
|---|---|
| Case | SEMITOP 3 |
| Chip Technology | High Performance Thermal Paste |
| Features | • New high performance thermal paste• Superior heat dissipation• Inhomogeneous honeycomb structure• Optimized thickness of thermal paste layer• High process reliability due to automated screen printing process |
| Housing | SEMITOP 3 |
| Part Number | 12281180 |
| Product Line | Thermal Interface Material |
| Product Type | TP(HPTP)SEMITOP3 |
| Weight in mg | 190 mg |