Product specifications
Characteristic | Value |
|---|---|
| Case | SEMiX 3p |
| Chip Technology | HALA TPC-V-PC-P-HT |
| Features | • Inhomogeneous honeycomb structure• Optimized layer thickness • Enhanced heat dissipation• High process reliability due to automated screen/stencil printing process• Phase Change Material |
| Housing | SEMiX 3p |
| Part Number | 12281040 |
| Product Line | Thermal Interface Material |
| Product Type | TP(HP-PCM) SEMiX 3p |
| Weight in mg | 250 mg |