Product specifications
Characteristic | Value |
|---|---|
| Case | SEMiX 3p |
| Chip Technology | HALA TPC-Z-PC-P8 |
| Features | • Inhomogeneous honeycomb structure• Optimized layer thickness • Enhanced heat dissipation• High process reliability due to automated screen/stencil printing process• Phase Change Material |
| Housing | SEMiX 3p |
| Part Number | 12281241 |
| Product Line | Thermal Interface Material |
| Product Type | TP(HALA P8) SEMiX 3p |
| Weight in mg | 250 mg |