Power Electronics for UPS Systems
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Power Electronics for UPS Systems
The availability of infrastructure systems strongly depends on reliable power supplies, irrespective of whether these systems are servers and cloud storage systems, critical traffic control, hospital services or other essential supply systems.
Uninterruptable Power Supplies (UPS) ensure continuous operation of these critical systems. In SEMIKRON power modules, flexible topologies equipped with the latest IGBT and diode chips ensure maximum conversion efficiency for online double conversion UPS systems. This efficiency can be further improved using Silicon Carbide technology.
Performance Range
- LOW POWER AND MODULAR UPS SYSTEMS10kVA - 100kVAServer Rooms, Data Centres
- High efficiency systems
- Compact designs and high power density
- STANDALONE AND TOWER UPS SYSTEMS100kVA - 5MVAServer Rooms, Data Centres, Hospitals and Critical Control Systems
- High efficiency systems
- Compact designs and high power density
Product Highlights
Compact and Efficient 100kVA Systems
UPS solutions for data centres today are based on modular UPS systems. In these systems several independent UPS modules in 19’’ frames are paralleled with single modules up to 100kVA. This achieves high scalability and easy implementation of redundancy.
The MiniSKiiP UPS power modules are available as symmetrical boost for the input stage and 3-level NPC topology for the output side. Both are based on fast swiching 650V IGBTs to allow high switching frequency and high efficiency at the same time, up to 100kVA output power. Optional Silicon Carbide components can increase efficiency even further.
- High power density thanks to MiniSKiiP UPS Power Modules
- Symmetrical Boost topology for battery voltage control and 3-level NPC topology for the output stage
- Designed for small power and 19’’ based modular UPS systems up to 100kVA
- Based on 650V IGBTs and Diodes, supporting up to 900V, optional Silicon Carbide components
- High power density system
- Easy mounting with just 2 screws per module thanks to SPRiNG technology, no soldering, not press-in process
Most Comprehensive UPS Portfolio
Highest UPS Power Density with SEMiX 5
With its comprehensive portfolio and its optimized design, the SEMiX 5 power modules are ideal for high-performance inverter architectures. The press-fit contacts ensure fast and solder-free driver board assembly, increased reliability and reduced assembly cost. An adapter board for easy gate drive integration is also available.
The internal chip layout is optimized for enhanced thermal performance, reducing operating temperatures and thus boosting reliability. The housing features rugged moulded power terminals for superior mechanical stability.
High power density thanks to comprehensive portfolio
- Biggest range of NPC and TNPC modules up to 400A nominal current
- Exceeding the standard: higher power density thanks to higher nominal currents in the same package
- Full range of symmetrical boost portfolio for input and battery charging
- Ready to use 3-level stack designs and application samples up to 500kW
Intelligent Power Modules – IPMs
The Most Powerful IPM in the Market
The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air or water cooling, also with customized heatsinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.
The IPMs of SKiiP 3 platform have propagated widely through the industrial drive segment. With sixpack or half-bridge topologies, it covers a IGBT nominal current range from 500A up to 2400A.
The SKiiP 4 platform products, available in half-bridge topology, cover the highe power range up to 3600A IGBT nominal current. It has been optimized for highest power cycling requirements.
To ensure highest reliability and service life, the SKiiP 4 power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layers between semiconductor chips and DCB, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.
Key Features
- 1200V and 1700V IGBTs
- Half-bridge and sixpack topology
- 500A to 3600A IGBT nominal current
- Flexible cooling options: air, water or customized cooling options, SKiiP 4 high performance water cooling for single and double-sided SKiiP mounting
- Paralleled operation for even higher output power possible
Power Electronic Stack Platforms
Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
Standard Stacks
SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver diode-, IGBT- and SiC-MOSFET-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.
- Water Cooled IGBT Stacks
SEMISTACK RE
SKiiPRACK
SEMIKUBE MLI - Air Cooled IGBT Stacks
SEMIKUBE
SEMIKUBE SlimLine - Diode/Thyristor Stacks
SEMISTACK CLASSIC B6U/B6C/W3C
Customized stacks
In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions. Engineers are available in our stack centres around the globe to offer such solutions by adapting existing platforms or designing customized stacks.
Four Key Factors for your success
- Shortest time to market
- Cost savings in R&D, production and qualification
- Global SEMIKRON stack production footprint
- Highly experienced engineering team
Thermal Interface Materials (TIM)
Stay Cool – Heat Dissipation is Our Job
SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material in thermal paste form. With more than two decades of field experience and more than 17 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silkscreen and stencil printing line.
For each requirement, SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.
SEMIKRON offers either thermal grease or phase change materials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate-less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.
Key Features
- Increased productivity thanks to reduced handling costs and improved logistics
- Low thermal resistance with optimized TIM layer thickness
- Improved lifetime and reliability
- Improved assembly robustness
- Modules can be shipped directly to the assembly line without any additional treatment processes
- Lower overall costs
Portfolio
- P8: Phase Change Material for highest performance
- HT: Phase Change Material for highest sink temperature
- HPTP: High Performance Thermal Paste
- P12: Standard Thermal Paste
