Power Electronics for Motor Drives
Our solutions for motor drives
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Power Electronics for Motor Drives
Since the first appearance of motor drives, SEMIKRON has been committed to supplying solutions for every power range. Starting with the first insulated power module, the SEMIPACK rectifier module series more than 40 years ago, the MiniSKiiP in particular has revolutionised the motor drive design for low and medium power systems.
Today SEMIKRON offers the complete industrial standard power module portfolio that serves a power range of 0.2kW to several megawatts. The portfolio is completed with high power IPMs, power electronic stacks and a comprehensive product line of driver electronics that help to reduce development effort and time-to-market. The latest Generation 7 IGBTs of two different suppliers, optimized for motor drive applications, boost performance and power density of motor drive converters.
Performance Range
- SERVO DRIVES0.2kW - 75kWRobotics, Material handling, Machine tools
- Compact designs and high power density
- High peak overload capabilities
- Multiple axis in one drive or modular drives with common DC bus
- Decentralized high IP grade drives
- LOW/MID POWER DRIVES0.2kW - 300kWPumps and fans, Process automation, Cranes and lifts, Marine drives
- Compact designs and high power density
- Platform designs, covering wide power range with the same mounting concept
- MID/HIGH POWER DRIVES300kW - 10MWOil, gas, mining industry, Chemical industry
- Compact designs and high power density
- High reliability in harsh environments
Technology Highlight
The Latest IGBT Generation from Two Suppliers for Highest Supply Chain Safety
The Generation 7 IGBT chips T7 and M7 enable higher power density and higher performance. Thanks to a new IGBT cell design the chip size could be reduced by approximately 25% compared to the previous generation.
The features translate into up to 20% higher output power in given power package. Thanks to the higher allowed operation temperature an overload of e.g. 110% can be covered without the need of additional design reserves.
Additionally the Generation 7 IGBTs share the following features:
- 20% lower on-state voltage VCE(sat)
- Operation junction temperature up to 175°C during overload
- High humidity robustness
- About 25% smaller chip size
- Up to 20% higher output power or 20% lower losses
- Up to 35% smaller housing
Product Highlights
The Power Density Master: New Levels Utilizing the Latest Generation 7 IGBT Chips
One continuous mounting concept from 0.4 to 110kW
- PCB based assembly concept with only 1 or 2 mounting screws
- High productivity mounting thanks to automatable production lines
- No additional tools required: No soldering, no press-in process required
- High vibration resistance
- Benchmark thermal resistance with High Performance Thermal Paste (HPTP)
One continuous module concept for all voltages and topologies
- 600/650V, 1200V, 1700V
- Available as CIB, sixpack, rectifier, brake chopper, twelvepack
- Hybrid Silicon Carbide version offers highest efficiency and power density
First SEMIKRON module to provide Generation 7 IGBT
- Generation 7 IGBTs T7 increase output power by up to 20%
IGBT and Rectifier Module Family for Complete Motor Drive Solutions
The SEMiX 3 Press-Fit module family features IGBT and rectifier modules in the same housing design for a complete medium/high power drive solution. As an industry standard power module available with the latest generation IGBT chips from different suppliers, it gives a full supply chain safety.
It‘s your choice: SEMiX 3 Press-Fit is available with optional ...
... integrated current measurement shunts. The integration of the current measurement into the power module replaces expensive and bulky current sensors (i.e. Hall sensors). This reduces size and cost of the motor drive system
... Plug-and-Play driver SKYPER 12 Press-Fit. Simply pressed onto the power module‘s press-fit pins, the driver reduces time-to-market thanks to a ready-to-go solution
... pre-applied thermal interface material (phase changer). The choice between two different materials optimises either the thermal performance or the allowed heatsink temperature.
Industry standard package with optional:
- Integrated current shunts
- Plug-and-Play gate driver
- Pre-applied phase change material
Available for a complete 17mm high solution
- Rectifier, brake chopper and half-bridge
- 650V / 1200V / 1700V; 225A to 700A
- 30kW up to 350kW
- Full second source thanks to several IGBT suppliers
- Hybrid Silicon Carbide version offers highest efficiency and power density
The latest Generation M7 IGBT
- 25% higher output power thanks to the new Generation 7 IGBT M7
Intelligent Power Modules – IPMs
For Maximum Reliability
The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air and water cooling, also with customized heatsinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.
The IPMs of SKiiP 3 platform have propagated widely through the industrial drive segment. With sixpack or half-bridge topologies, it covers a IGBT nominal current range from 500A up to 2400A.
The SKiiP 4 platform products, available in half-bridge topology, cover the high power range up to 3600A IGBT nominal current. It has been optimized for highest power cycling requirements.
To ensure highest reliability and service life, the SKiiP 4 power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layers between semiconductor chips and DCB, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.
High performance cooling (HPC) technology has been new introduced providing approximately 25% more output capability compared to standard water cooling. A double side mounting HPC water cooler is also available and enables an even higher power density.
Key Features
- 1200V and 1700V IGBTs
- Half-bridge and sixpack topology
- 500A to 3600A IGBT nominal current
- Flexible cooling options: air, water or customized cooling options, SKiiP 4 high performance water cooling for single and double-sided SKiiP mounting
- Paralleled operation for even higher output power possible
Power Electronic Stack Platforms
Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
Standard Stacks
SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver diode-, thyristor-, IGBT- and SiC-MOSFET-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.
- Water-Cooled IGBT Stacks
SKiiPRACK - Air-Cooled IGBT Stacks
SEMIKUBE
SEMIKUBE SlimLine - Diode/Thyristor Stacks
SEMISTACK CLASSIC B6U/B6C/W3C
Customized Stacks
In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions.Engineers are available in our stack centres around the globe to offer such solutions by adapting existing platforms or designing customized stacks.
Four Key Factors for your success
- Shortest time to market
- Cost savings in R&D, production and qualification
- Global SEMIKRON stack production footprint
- Highly experienced engineering team
Thermal Interface Materials (TIM)
Stay Cool – Heat Dissipation is Our Job
SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material in thermal paste form. With more than two decades of field experience and more than 17 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silkscreen and stencil printing line.
For each requirement, SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.
SEMIKRON offers either thermal grease or phase change materials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate-less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.
Key Features
- Increased productivity thanks to reduced handling costs and improved logistics
- Low thermal resistance with optimized TIM layer thickness
- Improved lifetime and reliability
- Improved assembly robustness
- Modules can be shipped directly to the assembly line without any additional treatment processes
- Lower overall costs
Portfolio
- P8: Phase Change Material for highest performance
- HT: Phase Change Material for highest sink temperature
- HPTP: High Performance Thermal Paste
- P12: Standard Thermal Paste
