Power Electronics for DC Fast Chargers

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Power Electronics for DC Fast Chargers

As electric vehicles become widespread, so must the infrastructure to charge them. One of the main requirements for the widespread use of electric vehicles is an accessible EV charging infrastructure. Governments and industries worldwide are preparing to invest in charging infrastructures.

Availability and costs are the key to success in the fast growing EV Charger market. As the specialist in power electronics, we use state-of-the-art topologies featuring standard components, guaranteeing both excellent efficiency and availability. SEMIKRON offers a comprehensive portfolio of products that meet the needs of fast charge equipment from as little as 8kW up to the megawatt range.

Performance Range

Product Highlights


Industrial Standard Combined with Superior Performance

DC Fast Chargers require a power dense PFC, DC/DC, and output rectifier, all available in the SEMITOP E1/E2 packages. With a low inductance design, fast switching Si and SiC chips may be used to their full potential. Achieve supply chain safety with this industrial standard module in a wide array of topologies.

Key Features

  • Low  inductance package
  • Multiple sourcing down to chip level
  • Optimized footprint
  • Flexible architecture
  • 2-screw concept
  • Press-Fit terminals
  • 12mm module height
  • No baseplate

The thermal resistance is up 20% lower than the closest competitor using standard thermal paste. Using High Performance Thermal Paste (HPTP), a further 25% reduction is possible.

More about SEMITOP E1/E2

Modular and Flexible Power for Your Charger Portfolio

The 50kW PowerCell is a full power converter including PWM controller and filters. With a modular design, the PowerCell may be paralleled to 450kW output power. The output voltage can seamlessly change between 500VDC and 1000VDC to meet any power requirement in the market.

Key Features

  • 50kW rated power
  • 500VDC or 1000VDC Isolated output
  • Scalable for high power charging
  • CANopen communication protocol
  • Easy integration and maintenance – all connections at the front
  • Parallel operation for high power charging
  • Integrated transformer for safe galvanic isolation
More about PowerCell
Optimised DC Chargers with SEMITOP E1/E2 – Power Electronics for DC Fast Chargers

Power Modules

Product Portfolio



Bipolar modules from the market leader

SEMiX® 3 Press-Fit

Exceeding the standard for superior performance

SEMiX® 5

Extended standard for superior thermal and dynamic performance


The proven power electronics packages

SKiM® 63/93

High reliability design using sinter technology


Exceeding the standard for superior performance

Power Electronic Stack Platforms

Fully Qualified Inverter Assemblies Tailored to Your Specific Needs

Standard Stacks

SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver diode-, IGBT- and SiC-MOSFET-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.

More about Power Electronic Stacks

Customized Stacks

In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions. Engineers are available in our stack centres around the globe to offer such solutions by adapting existing platforms or designing customized stacks.

Four Key Factors for your success:

  • Shortest time to market
  • Cost savings in R&D, production and qualification
  • Global SEMIKRON stack production footprint
  • Highly experienced engineering team
More about Customized Stacks

Product Portfolio IGBT Driver

Above the Standard

SEMIKRON’s unique product portfolio enables access to all established industries with a one-stop solution that combines state-of-the-art power modules and driver electronics.

SEMIKRON’s IGBT drivers are available as one- or two channel driver boards, two-channel driver cores for PCB-Integration, suitable for any standard semiconductor power module or as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, SEMITRANS 10 and compatible modules.

Cost Efficient

Achieve outstanding system compactness and create space-and cost-effective inverter designs with SEMIKRON’s drivers, utilizing highly integrated ASIC technology. Isolated DC-link voltage and temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce system costs significantly.

Time Efficient

More than 25 years of experience in developing innovative IGBT driver electronics enables SEMIKRON to have a short-term solution for almost every challenge related to driver electronics. SEMIKRON’s Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with SEMIKRON’s adapter boards or application sample PCBs. For the latter, SEMIKRON shares the entire manufacturing data to decrease development time, speeding up the time-to-market.


SEMIKRON’s SKYPER and SKHI drivers are well-known, highly robust and reliable IGBT driver solutions, even under demanding environmental conditions.

Over many years of field operation experience the proprietary IGBT driver technology has been relentlessly developed further. This technology sets new standards for the essential features of safe gate control, reliable protection and reinforced insulation.

Key Factors

  • Reinforced insulation for signal and power transmission
  • One- and two-channel driver
  • Up to 1700V transient collector-emmitter voltage
  • Up to 1500V continuous DC link voltage
  • 8Apk to 35Apk output current per channel
  • 1W to 4.2W peak output power per channel
  • Suitable for multi-level topologies and Generation 7 IGBT

Driver Cores

Plug-and-Play Driver

Driver boards, adapter Boards and Application Samples

Thermal Interface Materials (TIM)

Stay Cool – Heat Dissipation is Our Job


SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material in thermal paste form. With more than two decades of field experience and more than 17 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silkscreen and stencil printing line.

For each requirement, SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.

SEMIKRON offers either thermal grease or phase change materials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate-less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.

Key Features

  • Increased productivity thanks to reduced handling costs and improved logistics
  • Low thermal resistance with optimized TIM layer thickness
  • Improved lifetime and reliability
  • Improved assembly robustness
  • Modules can be shipped directly to the assembly line without any additional treatment processes
  • Lower overall costs


More about Thermal Interface Materials